Lv7
3495 积分 2021-05-05 加入
A Novelly Hierarchical LDHs−Based Cathode with Reduced Deprotonation Barrier Toward High−Performance Alkaline Energy Storage
30天前
已完结
Effect of Aluminum Porous Filling Methods on Mechanical Properties of Ordered– Disordered Porous Composite Structures
5个月前
已完结
Smoothing effect of H3BO3 on hydrogen evolution catalyst and the promotion of hydrogen evolution
7个月前
已完结
Study on predicting the temperature of stacked chip based on thermal resistance matrix
1年前
已完结
Study on predicting the temperature of stacked chip based on thermal resistance matrix
1年前
已完结
Leading edge die stacking and wire bonding technologies for advanced 3D memory packages
1年前
已完结
Numerical investigation on Sn-rich solder joints failure mode: Effects of the thermomechanical anisotropic performance
1年前
已完结
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load
1年前
已完结
Molecular dynamics study of tensile properties of graphene/GaN heterostructures
1年前
已关闭
Thermal performance evaluation of dual-side cooling for a three-dimensional (3D) chip stack: Additional cooling from the laminate (substrate) side
1年前
已完结
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