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402 积分 2024-05-24 加入
Thermal Conductivity of Thermal Interface Materials Evaluated By a Transient Plane Source Method
3个月前
已完结
Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers
3个月前
已完结
Nanothermal Interface Materials: Technology Review and Recent Results
3个月前
已完结
2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications
3个月前
已完结
Present and future thermal interface materials for electronic devices
3个月前
已完结
Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities
3个月前
已完结
Reliability of thermal interface materials: A review
3个月前
已完结
Novel nanostructured thermal interface materials: a review
3个月前
已完结
Recent progress in the development of thermal interface materials: a review
3个月前
已完结
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