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40 积分 2024-12-05 加入
SIMULATION IN THERMAL DESIGN FOR ELECTRONIC CONTROL UNIT OF ELECTRONIC UNIT PUMP
1天前
求助中
Development of Glass core substrate with the stress analysis, transmission characteristics and reliability
20天前
已完结
Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer
27天前
已完结
Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV)
1个月前
已完结
Dual‐active‐layer flexible piezoresistive sensor based on wrinkled microstructures and electrospun fiber network for human‐related motion sensing applications
1个月前
已完结
Prediction method of long-term creep deformation of mobile phone resin lens module in the harsh temp environment
1个月前
已完结
Filiform Papillae‐Inspired Wearable Pressure Sensor with High Sensitivity and Wide Detection Range
1个月前
已完结
An Electrical–Thermal Co-Simulation Model of Chiplet Heterogeneous Integration Systems
1个月前
已完结
A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System
1个月前
已完结
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