Lv1
20 积分 2022-02-27 加入
Reprocessable and degradable thermoset with high Tg cross-linked via Si–O–Ph bonds
1个月前
已关闭
Recyclable vitrimer-based printed circuit boards for sustainable electronics
2个月前
已完结
Multifunctional Nano‐Conductive Hydrogels With High Mechanical Strength, Toughness and Fatigue Resistance as Self‐Powered Wearable Sensors and Deep Learning‐Assisted Recognition System
2个月前
已完结
High-Performance Bismaleimide Resin with an Ultralow Coefficient of Thermal Expansion and High Thermostability
3个月前
已完结
Preparation of Hydrophobic Low-k Epoxy Resins with High Adhesion Using a Benzocyclobutene-Rosin Modifier
5个月前
已完结
One-Electron Oxidation of Electronically Diverse Manganese(III) and Nickel(II) Salen Complexes: Transition from Localized to Delocalized Mixed-Valence Ligand Radicals
5个月前
已完结
Effect of triphenylphosphine addition for the fast curing epoxy-anhydride CFRP system
5个月前
已完结
Cyclotriphophazene-Centered Six-Arm Eugenol-Linked Low-Dielectric Materials with High Thermostability and Transparency
5个月前
已完结
Cure Kinetics and Properties of High Performance Cycloaliphatic Epoxy Resins Cured with Anhydride
5个月前
已完结
Accelerated hydrolytic degradation of ester-containing biobased epoxy resins
5个月前
已完结
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