Lv3
370 积分 2022-05-24 加入
Electromigration in three-dimensional integrated circuits
7个月前
已完结
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature
1年前
已完结
Effect of external static magnetic field on the particle distribution, the metallurgical process and the microhardness of Sn3.5Ag solder with magnetic Ni particles
1年前
已完结
An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments
1年前
已完结
Characterization of In-Based Eutectic Alloys Used in Josephson Packaging
1年前
已完结
Effect of Joule heating and current crowding on electromigration in mobile technology
1年前
已完结
Electrocatalytic Oxygen Reduction for Selective H2O2 Synthesis and In-Situ Heterogeneous Electro-Fenton
1年前
已完结
Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging
1年前
已完结
Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives
1年前
已完结
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