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40 积分 2023-11-09 加入
A Strategic Review on Gallium Oxide Based Deep‐Ultraviolet Photodetectors: Recent Progress and Future Prospects
3小时前
已完结
Extremely Low Thermal Resistance of β-Ga2O3 MOSFETs by Co-integrated Design of Substrate Engineering and Device Packaging
1个月前
已完结
Packaged β-Ga 2 O 3 trench MOS Schottky Diode with Nearly Ideal Junction Properties
3个月前
已完结
Double side sintered IGBT 650V/ 200A in a TO-247 package for extreme performance and reliability
3个月前
已完结
Thermal and electrical reliability analysis of TO-247 for bonding method, substrate structure and heat dissipation bonding material
3个月前
已完结
Thermal and electrical reliability analysis of TO-247 for bonding method, substrate structure and heat dissipation bonding material
3个月前
已完结
Thermal and Thermomechanical Modeling to Design a Gallium Oxide Power Electronics Package
4个月前
已完结
Metallization, Material Selection, and Bonding of Interconnections for Novel LTCC and HTCC Power Modules
1年前
已完结
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