Lv4
420 积分 2023-11-09 加入
FEA study on the TSV copper filling influenced by the additives and electroplating process
25天前
已完结
Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing
25天前
已完结
Growth and characterization of β-Ga2O3 crystals
2个月前
已完结
Anisotropic thermal expansion tensor of β -Ga2O3 and its critical role in casting-grown crystal cracking
2个月前
已完结
TSV CMP Process Development and Pitting Defect Reduction
4个月前
已完结
CMP process development for the via-middle 3D TSV applications at 28nm technology node
4个月前
已完结
Improving the Heat Dissipation and Current Rating of Ga$_{2}$O$_{3}$ Schottky Diodes by Substrate Thinning and Junction-Side Cooling
6个月前
已关闭
Effect of Substrate Thinning on Temperature Rise in Ga2O3 Rectifiers
6个月前
已完结
Low-damage grinding process of gallium oxide based on cerium oxide
6个月前
已完结
Chemical-mechanical polishing improvementsand subsurface damage elimination for Cz grown (010) β-Ga2O3 substrates
6个月前
已完结
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