Lv41
450 积分 2021-06-29 加入
Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package
2小时前
待确认
A predictive methodology for BGA solder joint formation and assembly defects
1个月前
已完结
Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules
2个月前
已完结
Comprehensive Influences of Manufacturing Process Integrated with Thermal Cycling Test Loading on Mechanical Responses of Power Module
2个月前
已完结
Modeling the cure shrinkage–induced warpage of epoxy molding compound
3个月前
已完结
Study on the interface mechanism of copper migration failure in solder mask-substrate package
6个月前
已完结
An Accurate Simulation Method of Package Warpage Experimental Results Based on FEM
6个月前
已完结
Simulation methodology development of warpage estimation for epoxy molding compound under considerations of stress relaxation characteristics and curing conditions applied in semiconductor packaging
6个月前
已完结
Finite element modeling and analysis method for predicting and optimizing the warpage of construction before flip chip bonding in System-on-Wafer process flow
8个月前
已关闭
Modeling and Optimization of Mechanical Performance for Cu Wire Bonding Process
10个月前
已完结
皖公网安备34019202002308
