Lv3
400 积分 2021-06-29 加入
Study on Warpage after Post Solidifying of Ultrathin Fingerprint Package Products
1天前
已完结
Warpage Simulation Including the Effect of Molding Compound Cure Shrinkage
1天前
已完结
Warpage Simulation Including Effect of Process and MC Curing Shrinkage
1天前
已完结
Effect of Effective Curing Shrinkage of EMC on Strip Warpage During IC Encapsulation Process
2天前
已完结
Developing a Simulation Model to Improve Strip Warpage Performance Predictability
2天前
已完结
Finite Element Analysis of Interfacial Delamination in Double Side Molding Power Module SiP During Reflow
7天前
已完结
Research on Reliability of SnAg1.8/Cu Solder Joints in Extreme Environment
28天前
已完结
Investigation on the thermo-mechanical reliability of bump with different solder shape in ultra-large size FCBGA package
29天前
已完结
Optimization of Thermocompression Bonding Process for Fine-Pitch Flip-Chip Applications
29天前
已完结
Two-Phase Flow Simulation of Capillary Underfilling as a Design Tool for Heterogenous Integration
1个月前
已完结
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