Lv35
260 积分 2024-10-15 加入
Recent advances on chip-to-chip optical interconnect
13天前
已关闭
Improving the stiffness of multilayer 3D woven composites by the integration of shape memory alloys (SMAs) into structures
14天前
已完结
Polymeric membranes with aligned zeolite nanosheets for sustainable energy storage
22天前
已完结
Integrated photonic chip to chip interconnection utilising grating coupler technology
1个月前
已完结
Evidence of RNA polymerase III recruitment and transcription at protein-coding gene promoters
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