Lv2
170 积分 2022-09-07 加入
A DFT-based FD-KMC Simulation for Electrodeposition of Copper Nanoparticles on Carbon Electrode Surface
1天前
待确认
Effect of polymer additive on structural and morphological properties of Cu-electrodeposition from an acid sulfate electrolyte: Experimental and theoretical studies
6天前
已完结
Enhancement of Anti-oxidation and Tensile Strength of Nanotwinned Cu Foils by Preferential Ni electrodeposition
7个月前
已完结
Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives
7个月前
已完结
Preparation of Nano twin copper foil with high elongation and excellent suppression self-annealing via pulse superposition direct current method
7个月前
已完结
Microstructure-controlled Electrodeposition of Mechanically Reliable Double-layered Thin Foils for Secondary Batteries
7个月前
已完结
Processing and Specimen Thickness to Grain Size (t/d) Ratio Effects on Tensile Behaviour and Microformability of Copper Foils
7个月前
已完结
Study on the relationship between crystal plane orientation and strength of electrolytic copper foil
7个月前
已完结
Effect of long-period ordered stacking on twinning behavior and mechanical properties of Mg-Al-Y alloy during uniaxial hot compression
8个月前
已完结
Properties and Microstructure Regulation of Electrodeposited Ultra-thin Copper Foil in a Simple Additive System
8个月前
已完结
皖公网安备34019202002308
