Lv3
350 积分 2022-09-14 加入
Improvement of SiO2 surface morphology during the selective Si3N4 etching in the multi-layered 3D NAND Si3N4/SiO2 stack structures by the generation of CO2 gas through the control of redox reaction
3个月前
已完结
Preventing oxide precipitation in selective wet etching of Si3N4 for 3D-NAND structure fabrication: The role of bubbles
3个月前
已完结
Thin Layer Etching of Silicon Nitride: Comparison of Downstream Plasma, Liquid HF and Gaseous HF Processes for Selective Removal after Light Ion Implantation
3个月前
已完结
Passivation of poly-Si surface using vinyl and epoxy group additives for selective Si3N4 etching in H3PO4 solution
3个月前
已完结
Selective functionalization of silicon nitride with a water-soluble etch-resistant polymer
3个月前
已完结
Improvement of Si3N4/SiO2 etching selectivity through the passivation of SiO2 surface in aromatic carboxylic acid-added H3PO4 solutions for the 3D NAND integration
3个月前
已完结
Study on the SiO2 Wet-Etching Mechanism Using γ-Ureidopropyltriethoxysilane as an Inhibitor for 3D NAND Fabrication
3个月前
已完结
Wet‐Chemical Etching of Silicon Wafer Surfaces Using Aqueous HF‐HBrO 3 and HF‐HBrO 3 ‐Br 2 Solutions
3个月前
已完结
Highly Selective Etching of Silicon Dioxide Over Aluminum Using Mixtures of Sulfuric Acid and Hydrofluoric Acid
3个月前
已关闭
Understanding the contributions of F–, HF, and HF2– to the etching of SiO2 and unveiling the reaction kinetics to represent etching behavior of SiO2 up to pH 5
3个月前
已完结
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