Lv3
400 积分 2022-09-12 加入
Thermal Simulation of I/O Subsystem of an All-Electronic Computer Interlocking Based on Finite Element Analysis
3个月前
已完结
Thermal modeling and analysis of a power ball grid array in system-in-package technology
3个月前
已完结
Modeling Method for Analysis of the Current Density Distribution and IR Drop in Traces of the Printed Circuit Board
6个月前
已完结
Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package
1年前
已完结
Pareto based Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package
1年前
已关闭
Study of Electrical Characteristics for Dual-Gate TFTs With Asymmetric Defect Distributions and Gate Work Functions
1年前
已完结
A Fast Computational Method for the Optimal Thermal Design of Anisotropic Multilayer Structures with Discrete Heat Sources for Electrified Propulsion Systems
1年前
已完结
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