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560 积分 2023-11-02 加入
Research progress in chemical mechanical polishing (CMP) of silicon wafers for integrated circuits
17天前
已完结
Influences of pH environment on abrasive features and performance in chemical mechanical polishing Si-faces of SiC substrates
20天前
已完结
Characterization and reduction of copper chemical-mechanical-polishing-induced scratches
1个月前
已完结
Effect of Structures with Structured Surface Pad on Material Removal Rate in Chemical Mechanical Polishing
2个月前
已完结
Design of experiment and analysis of deformation for compression test of lattices using digital image correlation
2个月前
已完结
Formulation, characterization, mechanism, and application of vegetable oil-based nano-cutting fluids
2个月前
已完结
Copper matrix surface composites fabricated by friction stir processing: a review
2个月前
已关闭
Research progress of bearing bush preparation technology: a review
2个月前
已关闭
Ultrasonic surface treatment techniques based on cold working: a review
2个月前
已完结
Fundamentals of Post-CMP Cleaning
2个月前
已关闭
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