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50 积分 2023-10-16 加入
A novel bright additive for copper electroplating: electrochemical and theoretical study
3小时前
已完结
DFT study of interaction of additives with Cu(111) surface relevant to Cu electrodeposition
6个月前
已完结
A novel bright additive for copper electroplating: electrochemical and theoretical study
1年前
已完结
Manipulating coordination environment for a high-voltage aqueous copper-chlorine battery
1年前
已完结
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects
1年前
已完结
Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies
1年前
已完结
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