Lv5
1220 积分 2023-10-22 加入
Stress–strain analysis and prediction of WLCSP solder joints under bending–torsion coupled loading
17小时前
待确认
Broadband Characterization of Interconnects in Die-Embedded Glass Interposer
12天前
已完结
Thermal-Torsion Coupling Loading Analysis and Optimization of 3D PoP Assembly Solder Joints at Different Temperatures
15天前
已完结
Distribution Optimization of Through-Silicon Via (TSV) Array Based on Genetic Algorithm
16天前
已完结
Design of Microchannels Embedded in HTCC Substrate for Heat Dissipation of SiP With Multiple Chips
2个月前
已完结
Optimizing thermal performance in high-power-density 3D integrated circuits through advanced microchannel structures and multi-layer cooling
2个月前
已完结
Multi-objective Optimization Study of Stacked BGA Solder Joints under Coupled Bending-Vibration Load and Crosstalk Effects
2个月前
已完结
Investigation of Heat Dissipation and Electrical Properties of Diamond Interposer for 2.5-D Packagings
3个月前
已完结
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
6个月前
已完结
3D 集成电路中玻璃通孔侧壁粗糙度对微波性能的影响分析与优化
1年前
已关闭
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