Lv6
2150 积分 2023-10-22 加入
Performance optimization of aluminum slit fin-and-tube heat exchangers based on orthogonal experiments and response surface modeling
19小时前
待确认
Evolution of Electrical Transmission Characteristics in TSV and TGV Interconnect Structures Under Thermal Loading
1个月前
已完结
Reliability study and optimization of TSV interconnections with silicon interposer under random vibration
1个月前
已完结
Thermomechanical stress optimization in flip-chip packages: Impacts of copper pillar geometry on ultra-low-k layer reliability
1个月前
已完结
Multi-physics coupling simulation and numerical computation of die shift in fan-out wafer-level packaging
1个月前
已完结
Multi-physics coupling simulation and numerical computation of die shift in fan-out wafer-level packaging
1个月前
已完结
Evolution analysis of mechanical behaviours of through‑silicon via under thermal cycling load
1个月前
已完结
10.1016/j.microrel.2025.115647
1个月前
已关闭
Electrodeposition of Ni-Fe-based low CTE alloy for void-free through glass via filling to enhance the thermo-mechanical reliability of glass substrate
1个月前
已完结
Thermomechanical stress optimization in flip-chip packages: Impacts of copper pillar geometry on ultra-low-k layer reliability
1个月前
已完结
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