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1330 积分 2024-06-04 加入
Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling
2天前
已完结
Rapid silver sinter joining technology for large area chips
2天前
已完结
Optimization and simulation of nano-silver paste sintered copper interconnection process
2天前
已完结
Dependency of the Porosity and the Layer Thickness on the Reliability of Ag Sintered Joints during Active Power Cycling
12天前
已完结
Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation
12天前
已完结
Comparison of sintered silver die attach failure between thermal shock test and mechanical cycling test
23天前
已完结
Brief Review of Nanosilver Sintering: Manufacturing and Reliability
23天前
已完结
Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles
23天前
已完结
Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis
23天前
已完结
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