Lv7
3838 积分 2021-05-07 加入
Superior Bonding Reliability of Sintered Cu Bonding at Power Cycle Test
9天前
已完结
A lifetime evaluation of SiC devices bonded with copper and silver sintering
9天前
已完结
Packaging reliability estimation of high-power device modules by utilizing silver sintering technology
9天前
已完结
Application prospect of high-temperature silicon carbide devices and integrated circuits in space electronics
9天前
已完结
Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis
9天前
已完结
Self-oxygenation silver paste for SiC power modules with high thermal dissipation reliability
23天前
已完结
On the Interaction to Thermal Cycle Curve and Numerous Theories of Failure Criteria for Weld-Induced Residual Stresses in AISI304 Steel using Element Birth and Death Technique
25天前
已完结
Review of microstructure and properties of low temperature lead-free solder in electronic packaging
28天前
已完结
Novel accelerated failure mode of eutectic SnBi Solder joints under simultaneous electromigration and temperature cycling test
28天前
已完结
皖公网安备34019202002308
