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140 积分
2020-12-07 加入
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Materials for Advanced Packaging
6个月前
已完结
Assembly Process and Application Studies of Pre-Applied Underfill Non-Conductive Film (NCF) and Non-Conductive Paste (NCP) for Advanced Packages
7个月前
已完结
Development of a Flexure Mechanism for Thin Die Pick-up Process
7个月前
已完结
Benzethonium chloride as a tungsten corrosion inhibitor in neutral and alkaline media for the post-chemical mechanical planarization application
1年前
已完结
Selective Removal of Gold: N-Heterocyclic Carbenes as Positive Etch Resists on Planar Gold Surfaces
1年前
已完结
Inverse metal-assisted chemical etching of germanium with gold and hydrogen peroxide
1年前
已完结
Development of Tough Thermoplastic Elastomers by Leveraging Rigid–Flexible Supramolecular Segment Interplays
1年前
已完结
Limonene-derived polycarbonates as biobased UV-curable (powder) coating resins
1年前
已完结
Use of Limonene Epoxides and Derivatives as Promising Monomers for Biobased Polymers
1年前
已完结
Preparation and Characterization of 3D-Printed Biobased Composites Containing Micro- or Nanocrystalline Cellulose
1年前
已完结
TMEM100 negatively regulated by microRNA‑106b facilitates cellular apoptosis by suppressing survivin expression in NSCLC
3年前
已驳回
已自己找到【积分已退回】
2年前
速度真快
3年前
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