Lv5
1440 积分 2024-07-05 加入
Integrated, Heat Resistant, Glass Waveguides with 0.01 \text{dB}/\text{cm}$ Bend Loss for $50-\mu \mathrm{m}$ Pitch Conversion in High-Density Optical Interconnects
1个月前
已完结
An Investigation to Popcorning Mechanisms for IC Plastic Packages: EMC Cracking
1个月前
已完结
Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages
1个月前
已完结
A Methodology for Thermal Evaluation of Strongly Bonded Packaging Materials
1个月前
已完结
Assembly and Reliability Challenges for Next Generation High Thermal TIM Materials
1个月前
已完结
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
1个月前
已完结
Mechanical Characterization of Thermal Interface Materials and Its Challenges
1个月前
已完结
Thermal Performance of Laminate-to-Aluminum Attachment Materials
1个月前
已完结
TIM selection methodology for high power flip chip packages
1个月前
已完结
Joint Healing Thermal Interface Material
1个月前
已完结
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