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A Comparative Study of Cetylpyridinium Chloride and Cetyltrimethyl Ammonium Chloride as Levelers in Acidic Copper Electroplating: Electrochemical Evaluation and Theoretical Calculation
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Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications
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Hydride Formation and Decomposition on Cu(111) in HClO4
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