Lv5
802 积分 2022-02-09 加入
Preparation of fine copper powders by galvanostatic regime of electrolysis of copper scrap in a cylindrical electrochemical cell
7天前
已完结
Leveling and Microstructural Effects of Additives for Copper Electrodeposition
1个月前
已完结
Interactive Effects of Additives and Electrolyte Flow Rate on the Microstructure of Electrodeposited Copper Foils
1个月前
已完结
Influence of Additives and the Effect of Aging in Modifying Surface Topography of Electrodeposited Copper
2个月前
已完结
Functional additives inhibit crystal growth to achieve low-roughness and high-peel strength of micro-coarsening copper foil
2个月前
已完结
Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil
2个月前
已完结
Study on the relationship between crystal plane orientation and strength of electrolytic copper foil
3个月前
已完结
Research Progress on the Texture of Electrolytic Copper Foils
3个月前
已完结
Facile dynamic current deposition of high tensile gradient Cu foil with (110) preferred orientation
4个月前
已完结
Effects of DPS on Surface Roughness and Mechanical Properties of Electrodeposited Copper Foils
4个月前
已完结
Structural insights into a high fidelity variant of SpCas9
NEW FORMS AND ELEMENTS OF US PUBLIC DIPLOMACY FROM SOFT POWER TO DIALOGUEBASED PROPAGANDA
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