Lv6
2328 积分 2025-05-22 加入
Low-Temperature Mechanical Properties of Welded and Brazed Copper
2个月前
已完结
Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals
2个月前
已关闭
Preparation and properties of Cu6Sn5 intermetallic-bonded diamond grinding wheel for thinning SiC wafer
3个月前
已完结
Stable and efficient polishing of sapphire surface damage layers using polyurethane polishing wheel based on central supply polishing fluid
7个月前
已完结
Effect of TiO2/Al2O3 film coated diamond abrasive particles by sol–gel technique
8个月前
已完结
Insight into the Fracture Properties and Molecular Mechanism of Polyurethane
8个月前
已完结
An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing
8个月前
已完结
Grinding wheels for manufacturing of silicon wafers: A literature review
8个月前
已关闭
Wear characteristics of electroplated diamond dressing wheels used for on-machine precision truing of arc-shaped diamond wheels
8个月前
已完结
Effects of processing parameters and grinding direction on the material removal mechanism of (100) surface single crystal diamond in self-rotating mechanical grinding
8个月前
已关闭
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