Lv5
990 积分 2024-02-04 加入
Hydrophilic nanoporous copper surface prepared by modified formic acid vapor treatment
2天前
已完结
Aqueous electrophoretic deposition of citric-acid-stabilized copper nanoparticles
3天前
已完结
Solution-Processable Oxidation-Resistant Copper Nanowires Decorated with Alkyl Ligands
3天前
已完结
Enhanced oxidation resistance of active nanostructures via dynamic size effect
4天前
已完结
Surface coordination layer passivates oxidation of copper
4天前
已完结
One-step fabrication of a highly conductive and durable copper paste and its flexible dipole tag-antenna application
4天前
已完结
Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics
4天前
已完结
Synthesis of Cu nanoparticles using gamma-ray irradiation reduction method
5天前
已完结
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