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1156 积分 2025-10-23 加入
Thermally conductive composites based on hexagonal boron nitride nanosheets for thermal management: Fundamentals to applications
3天前
已完结
Recent Advances in UV ‐Curable Resins for Flexible Electronic Devices—Formulations, Properties, and Applications
11天前
已完结
Synthesis and characterization of fluorinated poly(aryl ether)s with excellent dielectric properties
13天前
已完结
Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging
20天前
已完结
Optimizing dielectric, mechanical, and thermal properties of epoxy resin through molecular design for multifunctional performance
20天前
已完结
Preparation and properties of low dielectric and flame-retardant epoxy resin/low molecular weight polyphenylene oxide composites
1个月前
已完结
Tailoring Dielectric Properties and Dimensional Stability of Poly(Phenylene Ether) Using Bismaleimide Crosslinkers for High‐Frequency PCB Applications
1个月前
已完结
Improving the Dimensional Stability of Polyphenylene Oxide without Reducing Its Dielectric Properties for High-Frequency Communication Applications
1个月前
已完结
Regulation and prediction of the dielectric constant and interfacial binding energy of surface modified hexagonal boron nitride/polyphenylene oxide@cyanate ester resin
1个月前
已完结
Polyphenylene oxide/SiO2 composites: Towards ultra-low dielectric loss and high thermal conductivity of microwave substrates
1个月前
已关闭
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