Lv66
2640 积分 2023-10-24 加入
Sequential Surface Treatment Process with VUV light and Ar Plasma for Room Temperature Au-Au Bonding
3天前
已完结
Adhesion Characteristics of Sputtered Cu Seed Layer on Cycloolefin Polymer
3天前
已完结
Analysis of the adhesion structure between the cycloolefin polymer and the copper seed layer formed using medium-vacuum sputtering
3天前
已完结
Reduction of Permanganate Treatment Time in Wet Desmearing Process Using Vacuum Ultraviolet Irradiation from Excimer Lamp
3天前
已完结
Optimization of gas-flow condition for a real scale semiconductor packaging process using the Photodesmear® method
3天前
已完结
Effect of Hydroxyl Group Concentration Generated by Vacuum Ultraviolet Light on the Adhesion Between Epoxy Resin and Copper
3天前
已完结
Study of the Behavior of the Functional Group on the Direct Copper Sputtered Interface using Vacuum Ultraviolet Light
2个月前
已完结
Activation of Copper Surfaces by VUV - Redox Method Using a Xenon Excimer Lamp
2个月前
已完结
Control of the Surface Modification of Epoxy Resin by VUV-Reduction and VUV-Redox Method using Vacuum Ultraviolet Light
2个月前
已完结
Preparation and Properties of PI@Cu Composite Films Current Collectors under Silver Catalysis for Lithium-ion Batteries
3个月前
已完结
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