Lv0
0 积分 2023-03-17 加入
Immersion liquid cooling for electronics: Materials, systems, applications and prospects
30天前
已完结
Investigations on heat dissipation performance and overall characteristics of two-phase liquid immersion cooling systems for data center
30天前
已完结
Die level thermal management of microelectronics using phase change materials
30天前
已完结
High thermal-conductive phase change material by carbon fiber orientation for thermal management and energy conversion application
30天前
已完结
Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices
1个月前
已完结
Investigation on Advanced Cold Plate Liquid Cooling Solution for Large Scale Application in Data Center
1个月前
已完结
Flexible Thermal Interface Materials with High Dispersion of Liquid Metal in Polyurethane induced by Sodium Alginate Microcapsules
1个月前
已完结
Large-area radiation-modulated thermoelectric fabrics for high-performance thermal management and electricity generation
1个月前
已完结
Bioinspired thermally conducting packaging for heat management of high performance electronic chips
1个月前
已完结
Nanoscale gradient interface for efficient heat transfer
1个月前
已完结
皖公网安备34019202002308
