Lv21
180 积分 2024-09-12 加入
Magnetic aligned AlN/epoxy composite for thermal conductivity enhancement at low filler content
9天前
已完结
An efficient thermal interface material with anisotropy orientation and high through-plane thermal conductivity
13天前
已完结
Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application
14天前
已完结
Electrocatalysis of the ammonia oxidation reaction
27天前
已完结
Ultra-high thermal conductive epoxy-based copper/graphite nanoplatelets materials for heat management application
1个月前
已完结
Soft and damping thermal interface materials with honeycomb‐board‐mimetic filler network for electronic heat dissipation
1个月前
已完结
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