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Remaining Useful Life Estimation using a combined Physics of Failure and Deep Learning-based approach on SAC305 Solder PCBs subjected to Thermo-Mechanical Vibration Loads
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期刊:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 作者:Pradeep Lall; Tony Thomas; Jeffrey Suhling; Ken Blecker 出版日期:2022-10-01 |
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