材料科学
石墨烯
共价键
阳极
硅
涂层
纳米技术
韧性
降级(电信)
复合材料
碳纤维
化学工程
光电子学
电极
复合数
电子工程
物理
工程类
物理化学
量子力学
化学
作者
Zhenshen Li,Ziyun Zhao,Siyuan Pan,Yaogang Wang,Sijia Chi,Xuerui Yi,Junwei Han,Debin Kong,Jing Xiao,Wei Wei,Shichao Wu,Quan‐Hong Yang
标识
DOI:10.1002/aenm.202300874
摘要
Abstract State‐of‐the‐art carbon coatings are sought to protect high‐capacity silicon anodes, which suffer from low conductivity, large volume change and fast degradation. However, this approach falls short when handling physical–electrical disconnections between carbon shells and silicon microparticulate (SiMP) with drastic size variations. Here, a strategy of covalent coating is developed to establish a robust encapsulation structure. The obtained covalent SiC bonds enable an effectively dynamic connection between the electrochemically deforming SiMP and the sliding graphene layers, preventing the evolution of gaps between SiMP and the carbon shell and maintaining persistent electrical connections as well as mechanical toughness. As a result of high structure reversibility, the cycling stability of thick SiMP anodes is greatly improved, up to a high areal capacity of 5.6 mAh cm −2 and volumetric capacity of 2564 mAh cm −3 . This interface bonding effect demonstrates the great potential for suppressing deformation involved degradation of high‐capacity materials through coating strategies.
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