CMOS芯片
可靠性(半导体)
材料科学
逻辑门
光电子学
电气工程
缩放比例
栅氧化层
电子工程
电压
工程类
晶体管
物理
量子力学
数学
功率(物理)
几何学
出处
期刊:IEEE Transactions on Semiconductor Manufacturing
[Institute of Electrical and Electronics Engineers]
日期:2007-08-01
卷期号:20 (3): 313-322
被引量:9
标识
DOI:10.1109/tsm.2007.901408
摘要
High performance analog (HPA) CMOS devices with multiple threshold voltages have been successfully fabricated in a 0.13-mum logic-based mixed-signal CMOS process on a single chip. The HPA devices demonstrate superior drivability, dc gain, matching, and reliability using an optimized halo and lightly doped drain (LLD) engineering approach combined with a unique dual gate oxide module for aggressive gate oxide thickness scaling.
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