芯(光纤)
光电子学
多核处理器
纤维
电子工程
复合材料
作者
Katsuhiro Takenaga,Yoko Arakawa,Shoji Tanigawa,N. Guan,Shoichiro Matsuo,Kunimasa Saitoh,Masanori Koshiba
出处
期刊:Optical Fiber Communication Conference
日期:2011-03-06
卷期号:: 1-3
被引量:85
标识
DOI:10.1364/ofc.2011.owj4
摘要
Trench-assisted multi-core fiber (TA-MCF) is proposed to achieve high dense MCF design with a solid structure. The crosstalk value at 1.55 µm of fabricated TA-MCF is estimated to be −35 dB at 100 km.
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