抛光
材料科学
光学
涟漪
空间频率
光圈(计算机存储器)
半径
声学
计算机科学
复合材料
物理
计算机安全
量子力学
电压
作者
Tayyab Suratwala,J. Menapace,G. Tham,R. Steele,Lana L. Wong,Nathan J. Ray,Brian Bauman
出处
期刊:Applied Optics
[The Optical Society]
日期:2022-04-04
卷期号:61 (11): 3084-3084
被引量:8
摘要
During sub-aperture tool polishing of glass optics, mid-spatial surface ripples are generated because of material removal non-uniformities during tool linear translation (resulting in feed ripples) and tool pathway step overlaps (resulting in pitch ripples). A variety of tool influence function (TIF) spots, trenches, and patches were created to understand and minimize such ripples on fused silica workpieces after polishing with cerium oxide slurry using a rotating hemispherical pad-foam tool. The feed ripple amplitude can be decreased by reducing the non-uniformities in the pad texture and/or by minimizing a derived feed ripple metric (rf=Vmax0.5Vf/Rt) via adjustments in processing parameters. Pitch ripples can be minimized by reducing relative step distance to spot radius ratio (xs/at) and by achieving a flat bottom trench shape cross section or by reducing the material removal per pass. Using the combined methods, an overall ripple error of ∼1.2nm rms has been achieved.
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