Patternable, High-Precision, Controllable Wettability Copper Layers for 3D Resin-Based Weather-Resistant Electronics and 3D Liquid Manipulation

The realization of 3D patterned metal layers with manipulable surface wettability has significant potential, especially in integrating microelectronics with weather resistance and multifunctional liquid manipulation. However, developing a facile and efficient method to bring it to fruition remains a great challenge. In this work, we proposed a novel 3D selective metallization strategy that combines stereolithography 3D printing with laser-induced selective metallization (LISM). Utilizing 355 nm UV or 1064 nm lasers, this strategy can prepare 3D conductive copper patterns (or circuits) with controlled wettability on various 3D-printed resin parts. The copper layer surface prepared