粘附
超分子化学
胶粘剂
材料科学
聚合
共价键
丙烯酸
聚合物
化学工程
纳米技术
高分子化学
化学
复合材料
分子
单体
有机化学
图层(电子)
工程类
作者
Changyong Cai,Huimin Gong,Shangjie Wu,Fenfang Li,Song Liu,Zhijian Tan,Shengyi Dong
标识
DOI:10.1016/j.cej.2022.138674
摘要
A supramolecular approach was applied to the construction of adhesive materials with excellent temperature resistance and strong adhesion capacity. Supramolecular hot-molten glues were prepared from two small compounds, acrylic acid (A) and choline chloride (C), using a combination of molecular recognition (formation of supramonomers) and supramolecular polymerization (formation of cross-linked polymers). The coexistence of covalent poly(A) backbones and non-covalent crosslinker C units enabled the poly(A-C)s to display tough adhesion effects with long-term stability at high (150 °C, 5.18 MPa) and low temperatures (–196 °C, 9.52 MPa) without any additives. Real-time and quantitative monitoring of the adhesion behavior of poly(A-C)s was successfully realized over a wide temperature range of −80 to 150 °C, using a customized device that allowed for easy monitoring of the adhesion duration, attenuation, and failure. Importantly, adhesion failure was visualized and wirelessly alarmed.
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