材料科学
钨
溅射
棒
杂质
半导体
钛
微观结构
硅
烧结
冶金
电极
光电子学
纳米技术
薄膜
物理化学
有机化学
化学
病理
替代医学
医学
作者
Yang Yu,Jiupeng Song,Feng Mei Bai,Ailong Zheng,Fusheng Peng
标识
DOI:10.1016/j.ijrmhm.2015.05.014
摘要
High purity (> 99.999 wt.%, 5N) or ultra-high purity (> 99.9999 wt.%, 6N) tungsten (W) electrodes are vital to the performance and lifetime of high intensity discharge (HID) lamps. On the other hand, alloys based on high purity (> 99.99 wt.% or 99.995 wt.%, 4N or 4N5) W are used as sputtering targets to deposit the films in semiconductor devices. In this study, a highly efficient and cost-saving method for mass producing 6N W powder has been developed. The 5N and 6N W rods and wires for the electrodes of HID lamps have been manufactured by using this powder. In addition, vacuum hot pressing has been employed to prepare 4N5 tungsten–titanium (W–Ti) and 4N tungsten–silicon (W–Si) sputtering targets successfully. The impurities and microstructures of the developed high purity W products have been investigated and are suitable for lighting, semiconductor and photovoltaic applications.
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