Preparation and properties of ODPA-ODA-SDA polyimide film and its application in corona resistance

材料科学 电介质 复合材料 纳米复合材料 聚酰亚胺 热稳定性 日冕(行星地质学) 化学工程 光电子学 图层(电子) 天体生物学 物理 工程类 维纳斯
作者
Feng Lang,Yu Xiang,Chunguang Xiao,Duxin Li
出处
期刊:Progress in Organic Coatings [Elsevier]
卷期号:166: 106777-106777 被引量:8
标识
DOI:10.1016/j.porgcoat.2022.106777
摘要

High-frequency trend of electrical equipment puts forward higher requirements on the dielectric properties of insulating materials, especially under corona ageing environment. Therefore, a facile and effective method for improved corona resistance is essential for the development of high-frequency power systems. In this article, 4,4′-Oxydiphthalic anhydride (ODPA) was chosen as the dianhydride while 4,4′-Diaminodiphenyl ether (ODA) and 4,4′-diaminodiphenyl sulphide (SDA) as diamines. Consequently, thermally imidized ODPA-ODA-SDA copolyimides were synthesized, and the influence of ODPA and SDA on the dielectric properties was discussed. High-frequency corona ageing test was also conducted to investigate the relationship between dielectric properties and the corona resistance. From dielectric frequency spectra analysis, the ODPA-ODA-SDA copolyimide was considered to exhibit the best dielectric properties when SDA accounted for 30% mole fraction of diamine, the dielectric loss of which was 24.03% lower than that of ODPA-ODA at 20 kHz. Meanwhile, the better corona resistance property and mechanical properties were obtained, especially the corona ageing lifetime was 2.26 times higher than that of ODPA-ODA. To further improve the corona resistance property, a series of modified-PI/Al2O3 nanocomposite films based on ODPA-ODA-SDA matrix were prepared by in-situ polymerization. When the content of Al2O3 nanoparticles reached 12 wt%, the thermal stability was improved and the corona ageing lifetime was 6.14 times longer than that of ODPA-ODA. This experiment provides new ideas and directions for reducing mechanical and thermal performance losses as well as achieving high-efficiency corona resistance, which is expected to promote the development of advanced insulating films.
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