负偏压温度不稳定性
可靠性(半导体)
超大规模集成
电子线路
可靠性工程
电子工程
数字电子学
计算机科学
架空(工程)
集成电路
电路可靠性
MOSFET
晶体管
功率(物理)
电气工程
工程类
电压
物理
量子力学
操作系统
作者
Kajal,Vijay Kumar Sharma
出处
期刊:Current Nanoscience
[Bentham Science]
日期:2024-05-01
卷期号:20 (3): 298-313
标识
DOI:10.2174/0115734137252023230919054547
摘要
Background: Electronic device scaling with the advancement of technology nodes maintains the performance of the logic circuits with area benefit. Metal oxide semiconductor (MOS) devices are the fundamental blocks for building logic circuits. Area minimization with higher efficiency of the circuits motivates the researchers of very large-scale integration (VLSI) design. Moreover, the reliability of digital circuits is one of the biggest challenges in VLSI technology. A major issue in reliability is negative bias temperature instability (NBTI) degradation. NBTI affects the efficiency and reliability of electronic devices Methods: This paper presents a review of NBTI physical-based mechanisms. NBTI's impact on VLSI circuits and techniques has been studied to mitigate and compensate for the effect of NBTI. Results: This review paper presents an idea to relate the NBTI and leakage mitigation techniques. This study gives an overview of the efficiency, complexity, and overhead of NBTI mitigation techniques and methodologies. Conclusion: This survey provides a brief idea about NBTI degradation by using reliability simulation. Moreover, the extensive aging effect is discussed in the paper.
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