光电子学
材料科学
绝缘体上的硅
光放大器
转印
光子学
光子集成电路
薄脆饼
硅光子学
波导管
放大器
半导体
硅
光学
物理
CMOS芯片
激光器
复合材料
作者
Bahawal Haq,Sulakshna Kumari,Kasper Van Gasse,Jing Zhang,Agnieszka Gocalińska,E. Pelucchi,Brian Corbett,Günther Roelkens
标识
DOI:10.1002/lpor.201900364
摘要
Abstract The micro‐transfer‐printing of prefabricated C‐band semiconductor optical amplifiers (SOAs) on a silicon waveguide circuit is reported. The SOAs are 1.35 mm in length and 40 µm in width. Dense arrays of III‐V SOAs are fabricated on the source InP wafer. These can then be micro‐transfer‐printed on the target SOI photonic circuits in a massively parallel fashion. Additionally, this approach allows for greater flexibility in terms of integrating different epitaxial layer structures on the same SOI waveguide circuit. The technique allows integrating SOAs on a complex silicon photonic circuit platform without changing the foundry process‐flow. Two different SOA designs with different optical confinement factor in the quantum wells of the III‐V waveguide are discussed. This allows tuning the small‐signal gain and output saturation power of the SOA. The design with higher optical confinement in the quantum wells has a small‐signal gain of up to 23 dB and an on‐chip saturation power of 9.2 mW at 140 mA bias current and the lower optical confinement factor design has a small‐signal gain of 17 dB and power saturation of 15 mW at 160 mA of bias current.
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