电镀(地质)
材料科学
脉搏(音乐)
电解质
电流密度
脉冲持续时间
电镀
复合材料
电压
图层(电子)
光学
化学
电气工程
工程类
电极
物理
激光器
物理化学
量子力学
地球物理学
作者
Yue Dai,Qing Wang,Yongbin Zhang,Guangmin Liu,Lin Zhang,Rui Wang
出处
期刊:Anti-corrosion Methods and Materials
[Emerald (MCB UP)]
日期:2022-07-12
卷期号:69 (5): 524-531
标识
DOI:10.1108/acmm-03-2022-2626
摘要
Purpose The purpose of this paper is to explore the optimum average current density and pulse width for electrodeposition of gold in citrate electrolyte, and it is verified that the uniformity of film thickness can be effectively improved by periodic pulse reverse electroplating. Design/methodology/approach Apply forward pulse current, forward group pulse current and periodic pulse reverse current to the electrolyte and compare the film quality. High-frequency group pulses are used in both forward and reverse directions of the periodic pulse reverse current. Findings It is verified by experiments that periodic pulse reverse plating is superior to forward pulse plating and forward group pulse plating in terms of particle size, compactness, impurity content and thickness uniformity of the film. Add low-frequency vibration to the cathode under the same pulse electrical parameters as a comparative experiment to prove the beneficial effect of vibration on the allowable limiting current density and plating rate. Originality/value Gold film is often used as the sealing layer of precision parts. Increasing the thickness uniformity and improving the compactness of gold film will help to reduce the size error, improve the subsequent assembly accuracy and increase the service life of wear-resistant layer. Citrate gold plating electrolyte combines the advantages of cyanide electrolyte and cyanide-free electrolyte. Hence, this research focuses on the characteristics of periodic pulse reverse plating in terms of particle size, compactness, impurity content and thickness uniformity of the film and compare it with forward pulse plating and forward group pulse plating.
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