Jörg Zimmermann,Jens Timo Neumann,Dirk Jürgens,Paul Gräupner
标识
DOI:10.1117/12.2687658
摘要
The EUV lithography optics program continues to enable the progress of the semiconductor roadmap with higher productivity and finer imaging resolution. ZEISS Starlith® lithography optics systems with a numerical aperture (NA) of 0.33 and an optical resolution of 13 nm half-pitch are being produced in high volume for integration into ASML´s NXE scanners, which have established themselves as industry workhorses in leading edge semiconductor manufacturing. Even finer imaging resolution will be achieved with the Starlith® 5000 for ASML´s EXE scanners, with NA = 0.55 and an optical resolution of 8 nm half-pitch, with highly flexible illumination and an anamorphic projection optics featuring a central obscuration. The first Starlith® 5000 illuminator and projection optics box have been delivered to ASML. The outlook includes future roadmap extensions for low-k1 imaging at increased productivity and potential further improvements of the single exposure resolution capabilities.