Fabrication of an X-shaped micro-copper structure containing a merging joint based on localized electrochemical deposition

Abstract Local electrochemical deposition (LECD) has proved to be an efficient and economical method for fabricating three-dimensional micron structures. Realizing complex structures that join up when deposited using LECD has been complex; therefore, the fabrication of an X-shaped joining structure was investigated in this study. A horizontal trace model was proposed, and the effects of the number of deposition layers and the horizontal sweep width on the merging joint were studied. The horizontal trace model could complete the merging joint. Multiple deposition layers and a large horizontal sweep width could stabilize and better connect the X-shaped structure containing merging joints. The merging mechanism of the X-shaped structure was also investigated using COMSOL. The stable deposition of the joining structure enables the LECD method to have a broader range of applications in micro-nano manufacturing.