电子背散射衍射
材料科学
聚焦离子束
自动化
纹理(宇宙学)
光学
微观结构
计算机科学
人工智能
复合材料
机械工程
图像(数学)
离子
物理
量子力学
工程类
作者
J.J.L. Mulders,A. P. Day
出处
期刊:Materials Science Forum
日期:2005-09-01
卷期号:495-497: 237-244
被引量:23
标识
DOI:10.4028/www.scientific.net/msf.495-497.237
摘要
Three-dimensional (3D) microscopy is a new and rapidly expanding area. A DualBeam system, with both a focused ion beam (FIB) column and an electron column, is a powerful instrument for imaging and sectioning microstructures to generate a full 3D sample reconstruction. When an electron backscatter diffraction (EBSD) system is attached to the DualBeam, it becomes a unique tool for making 3D crystallographic measurements on a wide variety of materials. Combining the successive removal by FIB, with sequential EBSD maps taken with the electron beam requires clear geometric considerations and a high level of automation to obtain a decent resolution in the third dimension, including positional sub-pixel re-alignment. Complete automation allows controlled sectioning and analysis of a significant volume of material without operator intervention: a process that may run continuously and automatically for many hours. Using a Nova600, a Channel 6 EBSD system and dedicated control software, Aluminium, Nickel and Steel specimens have been examined and volumes with up to 200 slices have been successfully analysed.
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