发射率
材料科学
低发射率
基质(水族馆)
合金
扩散
图层(电子)
扩散阻挡层
耐久性
冶金
金属
复合材料
光学
热力学
物理
海洋学
地质学
作者
Zhibin Huang,Weihua Zhou,Xiufeng Tang,Fa Luo,Dongmei Zhu
标识
DOI:10.1016/j.apsusc.2010.04.107
摘要
The 200 nm-thickness Ni film was imposed as the diffusion barrier layer between the Au film and the alloy substrate to improve the low-emissivity durability of the Au film at high temperature. The results show that the Au/Ni multilayer films still kept low emissivity after working at 600 °C for 200 h. It was concluded that the Ni interlayer effectively retarded the diffusion between gold film and the metal alloy below 600 °C.
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