电子设备和系统的热管理
热的
工程物理
材料科学
电力电子
作者
Shanmuga Sundaram Anandan,Velraj Ramalingam
出处
期刊:Thermal Science
[Vinča Institute of Nuclear Sciences]
日期:2008-01-01
卷期号:12 (2): 5-26
被引量:138
摘要
Due to rapid growth in semiconductor technology, there is a continuous increase of the system power and the shrinkage of size. This resulted in inevitable challenges in the field of thermal management of electronics to maintain the desirable operating temperature. The present paper reviews the literature dealing with various aspects of cooling methods. Included are papers on experimental work on analyzing cooling technique and its stability, numerical modeling, natural convection, and advanced cooling methods. The issues of thermal management of electronics, development of new effective cooling schemes by using advanced materials and manufacturing methods are also enumerated in this paper. .
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