焊接
材料科学
金属间化合物
铅(地质)
焊接
微观结构
冶金
可靠性(半导体)
复合材料
量子力学
地貌学
物理
地质学
功率(物理)
合金
作者
Duanpeng He,Yan Li,Ruoyuan Qu,Xiangtian Yu,Bing Wu,Hong Gao
出处
期刊:Journal of physics
[IOP Publishing]
日期:2021-10-01
卷期号:2044 (1): 012061-012061
被引量:1
标识
DOI:10.1088/1742-6596/2044/1/012061
摘要
Reliable, nontoxic and eco-friendly solders are gaining attention in welding. Low-silver lead-free solder becomes a developing trend. Herein, the microstructures of Low-silver lead-free Sn1.0Ag0.5Cu micro-joints at different storage time in high-temperature environments are observed and analysed in this article. It is our primary focus here to analyse the thickness evolution of the interfacial intermetallic compound (IMC) layer. The numerical growth models of IMC bilayers are constructed, which provide an essential reference for lifetime analysis and reliability evaluation of Sn1.0Ag0.5Cu solders for long-term use in high temperature environment.
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