Diamond‐Reinforced Al(H2PO4)3@Epoxy Hybrid Thermal Adhesive With Ultra‐High Thermal Conductivity and Bonding Strength

The miniaturization, integration, and increased power of electronic devices have exacerbated serious heat dissipation issues. Thermally conductive adhesives, which effectively transfer heat and firmly bond components, are critical for addressing these challenges. This paper innovatively proposed a composite comprising inorganic phosphate/alumina as a matrix and diamond as filler. The composite achieved an isotropic thermal conductivity (TC) of up to 18.96 W m