Study on curing process using atmospheric pressure plasma for silicone-based and epoxy-based electrically conductive adhesive

Abstract A curing for silicone- and epoxy-based electrically conductive adhesives (ECAs) using atmospheric pressure plasma (APP) was investigated. The results show that the volume resistivities of both ECAs were decreased as a function of the plasma treatment time. It reveals that APP enables the curing treatment of silicone- and epoxy-based ECAs. It was found that the volume resistivity of silicone- and epoxy-based ECAs differed depending on the treatment method. We observed samples surface by a field emission-scanning electron microscope (FE-SEM) and an energy dispersive X-ray spectroscopy (EDS). The results show that the carbon-derived membrane formed on the surface.