A comprehensive review on thermal management of electronic devices

Abstract In the field of electronics thermal management (TM), there has already been a lot of work done to create cooling options that guarantee steady-state performance. However, electronic devices (EDs) are progressively utilized in applications that involve time-varying workloads. Therefore, the TM systems could dissipate the heat generated by EDs; however, there seemed to be a necessity for a design that would contain temperature rise within an acceptable range for limiting hot spots and managing thermal transients induced by higher-frequency operating cycles. Heat dissipation issues become more significant when miniaturization in electronics increases. More effective TM often results in enhanced reliability as well as a longer life expectancy for devices. Hence, this paper explicates the TM of EDs, the comparison of cooling methods, the comparison of convections for TM on EDs, the heat source (HS) mounted on the substrate board, and optimization techniques to optimize the size and position of HSs mounted on the substrate board. This paper also analyzes the TM technologies on different EDs from 2014 to 2023 and the comparison of the thermal conductance of EDs with two types of phase change materials (PCMs) and pin-fin heat pipes (HPs).