Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

聚烯烃 弹性体 材料科学 热导率 石墨烯 复合材料 散热膏 微电子 极限抗拉强度 纳米技术 图层(电子)
作者
Xin Sun,Zhengyi Wang,Yang Wang,Xiang‐Yun Du,Jidong Liu,Cheng Zhang,Weili Li,Zheng‐Bai Zhao
出处
期刊:Chemistry of Materials [American Chemical Society]
卷期号:35 (6): 2486-2494 被引量:40
标识
DOI:10.1021/acs.chemmater.2c03730
摘要

Heat dissipation has become a central issue for the development of the microelectronic industry. Thermal interface materials (TIMs) have been widely applied to electron component cooling, which is used to bond the heat spreader and the chip together. Most research on TIMs has only dealt with thermal conductivity enhancement. However, the mechanical properties and adhesion of TIMs are indispensable for practical applications, as well as postcleaning to remove TIMs. A graphene nanosheet/polyolefin elastomer (GNP/POE) film was designed and prepared by a facile method, in which the heat conduction paths were efficiently constructed, and the good mechanical properties of POE were reserved. The thermal conductivity of as-prepared GNP/POE film can reach 1.07 W m–1 K–1 at an extremely low filler loading of 0.62 wt %. Furthermore, the tensile strength, elongation at break, and adhesion of the prepared GNP/POE film are as good as those of commercial TIM productions. The prepared GNP/POE film can be used as TIMs for chip cooling and exhibits a good heat dissipation effect. Additionally, the prepared GNP/POE film can be peeled off from the chip without residue, after the chip has finished running, which is significant for practical production. This work provides valuable information and insight into the design and fabrication of TIMs in the future.
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