Thermal Conduction and Solutions

This chapter briefly introduces the concepts of thermal conduction, various thermal resistances, thermal resistance network, and thermal impedance. Then, it introduces the widely used high thermal conductivity (TC) materials of different components (chips, solders, heat spreaders, substrates, encapsulation polymer composites, and coolants) in electronic packaging. In addition, the chapter discusses the categories of thermal interface materials (TIMs), thermally conductive fillers, and polymers. It explains the model for TC of TIMs and strategies for enhancing TC of TIMs. Besides, the chapter introduces heat pipe and vapor chamber with special structures and extra high thermal diffusion performances. It presents the application of phase-change materials in thermal conductivity enhancement, as well as the thermal metamaterials with novel heat control abilities. The chapter also explains basic thermal conduction theory in high-power electronic devices and the corresponding thermal management materials and solutions.