Lv4
740 积分 2024-07-02 加入
Passive thermal management of electronic devices
1个月前
已完结
Passive thermal management of electronic devices using sorption-based evaporative cooling
1个月前
已完结
Thermal management enhancement of electronic chips based on novel technologies
1个月前
已完结
Experimental Investigation of a Compact Lid-Compatible Multi-jet Impingement Manifold for Direct-On-Chip Cooling
3个月前
已完结
Multi-Physics Coupling in IGBT Modules: A Review
4个月前
已关闭
A Novel Double-sided Cooling 3L-ANPC SiC MOSFET Power Module with Interleaved Layout
4个月前
已关闭
Compact Spatially Symmetric Double-Sided Embedded Packaging Method for Parallel SiC MOSFETs
4个月前
已完结
Conduction Thermal Runaway of SiC MOSFET Under Natural Convection Heat Dissipation
4个月前
已完结
Compact Spatially Symmetric Double-Sided Embedded Packaging Method for Parallel SiC MOSFETs
4个月前
已完结
Review of Heat Transfer Technologies in Electronic Equipment
5个月前
已完结
Surfactant-free Synthesis and Growing Process of One-dimensional Mg–Al Layered Double Hydroxide Nanobelts
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