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220 积分 2024-07-02 加入
Multi-Physics Coupling in IGBT Modules: A Review
15天前
已关闭
A Novel Double-sided Cooling 3L-ANPC SiC MOSFET Power Module with Interleaved Layout
17天前
已关闭
Compact Spatially Symmetric Double-Sided Embedded Packaging Method for Parallel SiC MOSFETs
20天前
已完结
Conduction Thermal Runaway of SiC MOSFET Under Natural Convection Heat Dissipation
22天前
已完结
Compact Spatially Symmetric Double-Sided Embedded Packaging Method for Parallel SiC MOSFETs
23天前
已完结
Review of Heat Transfer Technologies in Electronic Equipment
28天前
已完结
Multi-objective topology optimization and thermal performance of liquid-cooled microchannel heat sinks with pin fins
28天前
已关闭
A computational case study on the thermal performance of a rectangular microchannel having circular pin-fins
28天前
已关闭
A comprehensive review of air-cooled heat sinks for thermal management of electronic devices
30天前
已完结
Numerical and experimental study on manifold-distributed jet microchannel with micro-pin-fins
30天前
已完结
Surfactant-free Synthesis and Growing Process of One-dimensional Mg–Al Layered Double Hydroxide Nanobelts
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